← Back to PeopleHTExecutiveHe TingboVP at HuaweiSemiconductor president at Huawei1Mentions1Articles1OutletsCompanies CoveredHuawei1ArticlesMost recent firstMentioned InReferenced in coverageHuawei Says It Can Match Cutting-Edge Chips Within 5 YearsThe InformationcautiousMay 27, 2026“Unveiled Huawei's LogicFolding design technology that stacks 2D circuits into 3D structures to achieve 1.4-nanometer equivalent performance by 2031.”